Why DFM pays for itself
A design-for-manufacture review catches the errors that turn into scraps, field returns and respin cost. None of it is glamorous; all of it is cheaper before the panel is cut. Run this list while the board is still in the tool.
Stack-up and copper
- Annular ring: keep ≥0.15 mm on vias you actually need to hit; below that, expect occasional tangency.
- Trace/space: match the shop's capability (typically 0.1 mm for standard, 0.075 mm for fine). Don't design to the limit unless you must.
- Copper balance: on multilayer, balance copper per layer to avoid warp.
Drilling and vias
- Aspect ratio: keep hole depth ≤ ~8× diameter for reliable plating.
- Via-in-pad: cap or fill it; an open via under a BGA ball traps solder.
- Non-plated holes: call them out explicitly or they will be plated by default.
Assembly readiness
- Solder mask dams: between fine-pitch pads, or bridges follow.
- Silkscreen: keep it off pads and keep text ≥0.8 mm tall.
- Test points: leave a few exposed pads for flying-probe ICT.
- Fiducials: add global and panel fiducials for the placer.
Close the loop
Hand the checklist to your CM at RFQ. We return a DFM report with the exact items above flagged on your gerbers — see our prototyping service for how fast that turnaround is. Send the files and we will review before you pay for a panel.